Msika wapadziko lonse wa ma CD ndi mayeso a semiconductor ukuyembekezeka kukhalabe wokhazikika mu 2026, chifukwa cha kuchuluka kwa kufunikira kwa luntha lochita kupanga, zamagetsi zamagalimoto, ndi makompyuta ogwira ntchito bwino.
Akatswiri amakampani akuwona kuti ukadaulo wapamwamba wopaka, kuphatikizapo kuyika ma wafer-out wafer-level packaging (FOWLP), 2.5D ndi 3D packaging, ukufunikira kwambiri pamene opanga ma chip akutsatira kuphatikiza kwakukulu ndi zinthu zazing'ono.
Kuchuluka kwa ndalama m'malo opangira zinthu zamagetsi padziko lonse lapansi kumathandizanso kukulitsa unyolo woperekera zinthu. Pamene zipangizo zamagetsi zikukhala zanzeru komanso zogwirizana, kufunikira kwa njira zodalirika komanso zolondola kwambiri zoperekera zinthu kudzapitirirabe kukhala kolimba m'magawo onse ogula, mafakitale, ndi magalimoto.
Nthawi yotumizira: Mar-02-2026