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Newmary News: Samsung kuti ikhazikitse ntchito ya 3d HbM SCAGING mu 2024

Newmary News: Samsung kuti ikhazikitse ntchito ya 3d HbM SCAGING mu 2024

San Jose - Samsung Electronics Co. Idzakhazikitsa Mitundu Yapamwamba Yapamwamba (HBM) mkati mwa chaka, ukadaulo womwe akuyembekezeka kumeza matenda a Hbm4 chifukwa cha 2025, malinga ndi kampani ndi makampani.
Pa Juni 20, okumbukira kwambiri padziko lonse lapansi sanadziwike ukadaulo waposachedwa ndi ntchito zam'manja ku Samsung adayambitsa foro 2024 yomwe idachitikira ku San Jose, California.

Inali nthawi yoyamba Samsung kuti itulutse ukadaulo wa 3D wa HBM tchipisi pagulu. Pakadali pano, tchipisi cha HBM zimaphatikizidwa makamaka ndi ukadaulo wa 2.5d.
Inafika patapita milungu iwiri Nvidia Co-Poyambitsa ndi Chief Executive Cupturformafform a ruptin ya ku Taiwan.
HBM4 imaphatikizidwa mu mtundu watsopano wa Nfidia Gisin Gusin Guwiri yemwe akuyembekezeka kugunda pamsika mu 2026.

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Kulumikizana kolunjika

Tekinoloje yaposachedwa ya Samsung imapereka chips cholumikizidwa pamwamba pa GPU yowonjezera maphunziro a data ndi ntchito, ukadaulo woyatsidwa ndi masewera othamanga kwambiri.
Pakadali pano, tchipisi cha HBM ndi cholumikizidwa molunjika ndi GPU pa Silicon kutanthauzira pansi pa ukadaulo wa 2.5d.

Poyerekeza, malemba 3d safuna kutanthauzira silika, kapena gawo loonda lomwe limakhala pakati pa tchipisi kuti azilola kuti azilankhulana komanso kugwira ntchito limodzi. Samsung imakhala ndi ukadaulo wake watsopano monga Saint-d, lalifupi la samsung apamwamba aukadaulo - d.

Kugwira ntchito

Kampani yaku South Korea imamveka kuti iperekedwe kuti apereke 3d Hbm Carder pa encykey.
Kuti tichite izi, gulu lake lapamwamba lidzalumikizani ma stripind hbm cholumikizira cha bizinesi yomwe ili ndi GPUS yolumikizidwa ndi makampani opezeka ndi gawo lake.

"Masamba 3 amachepetsa kugwiritsa ntchito mphamvu ndi kukonzanso, kukonza mawonekedwe a magetsi a tchipisi a semiconducy. Mu 2027, Samsung akufuna kukhazikitsa ukadaulo wophatikizana womwe umakhala ndi zinthu zowoneka bwino zomwe zimawonjezera kuthamanga kwa semiconductor mu phukusi limodzi lolumikizidwa ndi AI.

Mogwirizana ndi tchipisi chokulirapo kwa tchipisi chotsika kwambiri, HBM imatsimikiziridwa kuti ipange 30% ya msika wokwera mu 2025 kuchokera pa 21% mu 2024, malinga ndi momwe amayendera, kampani yofufuzira taiwanese.

Kafukufuku Wofufuza Msika Msika Wotsogola, kuphatikiza 3D ma CD, kuti akule mpaka $ 80 biliyoni pofika 2032, poyerekeza ndi $ 343 biliyoni mu 2023.


Post Nthawi: Jun-10-2024