SAN JOSE -- Kampani ya Samsung Electronics Co. iyambitsa ntchito zopaka ma CD a 3D a high-bandwidth memory (HBM) mkati mwa chaka chino, ukadaulo womwe ukuyembekezeka kuyambitsidwa mu HBM4 ya m'badwo wachisanu ndi chimodzi ya chipangizo cha artificial intelligence chomwe chidzachitike mu 2025, malinga ndi kampaniyo ndi magwero amakampani.
Pa June 20, kampani yayikulu kwambiri padziko lonse lapansi yopanga ma chips okumbukira idavumbulutsa ukadaulo wake waposachedwa kwambiri wopangira ma chips komanso njira zogwirira ntchito pa msonkhano wa Samsung Foundry Forum 2024 womwe unachitikira ku San Jose, California.
Inali nthawi yoyamba kuti Samsung itulutse ukadaulo wa 3D pa ma chips a HBM pamwambo wapagulu. Pakadali pano, ma chips a HBM amapakidwa makamaka ndi ukadaulo wa 2.5D.
Izi zinachitika patatha milungu iwiri kuchokera pamene Jensen Huang, yemwe anayambitsa Nvidia komanso CEO, adavumbulutsa kapangidwe katsopano ka nsanja yake ya AI Rubin, panthawi yolankhula ku Taiwan.
HBM4 mwina idzaikidwa mu mtundu watsopano wa Nvidia wa Rubin GPU womwe ukuyembekezeka kufika pamsika mu 2026.
KULANKHULANA KWA ODIMA
Ukadaulo waposachedwa wa Samsung wopaka ma CD uli ndi ma chip a HBM omwe amaikidwa molunjika pamwamba pa GPU kuti apititse patsogolo kuphunzira deta komanso kukonza ma inference, ukadaulo womwe umawonedwa ngati wosintha zinthu pamsika wa ma chip a AI womwe ukukula mwachangu.
Pakadali pano, ma chips a HBM alumikizidwa mopingasa ndi GPU pa silicon interposer pogwiritsa ntchito ukadaulo wa 2.5D packing.
Poyerekeza, ma CD a 3D safuna silicon interposer, kapena substrate yopyapyala yomwe imakhala pakati pa ma chips kuti azitha kulankhulana ndikugwira ntchito limodzi. Samsung imatcha ukadaulo wake watsopano wa ma CD kuti SAINT-D, mwachidule Samsung Advanced Interconnection Technology-D.
UTUMIKI WA TURNKEY
Kampani yaku South Korea ikumveka kuti imapereka ma phukusi a 3D HBM pamtengo wotsika.
Kuti zimenezi zitheke, gulu lake lapamwamba lokonza zinthu lidzalumikiza ma chips a HBM opangidwa ku gawo lake la bizinesi yokumbukira ndi ma GPU omwe amapangidwa ndi makampani osapanga zinthu zakale ndi chipangizo chake chopangira zinthu.
"Kuyika ma CD a 3D kumachepetsa kugwiritsa ntchito mphamvu ndi kuchedwa kukonza, ndikukweza ubwino wa ma signali amagetsi a ma semiconductor chips," adatero mkulu wa Samsung Electronics. Mu 2027, Samsung ikukonzekera kuyambitsa ukadaulo wophatikizana wosiyana womwe umaphatikizapo zinthu zowala zomwe zimawonjezera kwambiri liwiro lotumizira deta ya ma semiconductors mu phukusi limodzi logwirizana la ma accelerator a AI.
Mogwirizana ndi kufunikira kwakukulu kwa ma chips amphamvu komanso othamanga kwambiri, HBM ikuyembekezeka kupanga 30% ya msika wa DRAM mu 2025 kuchokera pa 21% mu 2024, malinga ndi TrendForce, kampani yofufuza ku Taiwan.
Kafukufuku wa MGI akuneneratu kuti msika wotsogola wopaka zinthu, kuphatikizapo ma CD a 3D, udzakula kufika pa $80 biliyoni pofika chaka cha 2032, poyerekeza ndi $34.5 biliyoni mu 2023.
Nthawi yotumizira: Juni-10-2024