SAN JOSE -- Samsung Electronics Co. ikhazikitsa ntchito zopakira zamitundu itatu (3D) ya high-bandwidth memory (HBM) mkati mwa chaka, ukadaulo womwe ukuyembekezeka kuyambitsidwa wamtundu wachisanu ndi chimodzi wa intelligence chip wa HBM4 womwe uyenera kuchitika mu 2025, malinga ndi kampani ndi magwero amakampani.
Pa Juni 20, wopanga makina okumbukira kwambiri padziko lonse lapansi adavumbulutsa ukadaulo wake waposachedwa wapackaging ndi mayendedwe apamsewu pa Samsung Foundry Forum 2024 ku San Jose, California.
Aka kanali koyamba kuti Samsung itulutse ukadaulo wapackage wa 3D wa tchipisi ta HBM pagulu.Pakadali pano, tchipisi ta HBM ndizopangidwa makamaka ndi ukadaulo wa 2.5D.
Zinafika pafupifupi milungu iwiri pambuyo poti woyambitsa mnzake wa Nvidia ndi Chief Executive Jensen Huang adavumbulutsa kamangidwe ka m'badwo watsopano wa nsanja yake ya AI Rubin pakulankhula ku Taiwan.
HBM4 ikhoza kuphatikizidwa mu mtundu watsopano wa Nvidia wa Rubin GPU womwe ukuyembekezeka kugundika pamsika mu 2026.
VERTICAL CONNECTION
Ukadaulo waposachedwa wa Samsung wapakapaka umakhala ndi tchipisi ta HBM zokhazikika pamwamba pa GPU kuti ipititse patsogolo kuphunzira kwa data ndikuwongolera, ukadaulo womwe umawonedwa ngati wosintha masewera pamsika womwe ukukula mwachangu wa AI chip.
Pakadali pano, tchipisi ta HBM zimalumikizidwa molumikizana ndi GPU pa silicon interposer pansi pa ukadaulo wapackage wa 2.5D.
Poyerekeza, kuyika kwa 3D sikufuna silicon interposer, kapena gawo lochepa kwambiri lomwe limakhala pakati pa tchipisi kuti liwalole kulumikizana ndikugwira ntchito limodzi.Samsung imatchula ukadaulo wawo watsopano woyikapo kuti SAINT-D, wachidule wa Samsung Advanced Interconnection Technology-D.
TURNKEY SERVICE
Kampani yaku South Korea imadziwika kuti imapereka ma CD a 3D HBM panjira.
Kuti achite izi, gulu lake lonyamula katundu lapamwamba lidzalumikiza tchipisi ta HBM chopangidwa pagawo lake lamabizinesi okumbukira ndi ma GPU osonkhanitsira makampani opanda pake ndi gawo lake loyambira.
"Kupaka kwa 3D kumachepetsa kugwiritsa ntchito mphamvu komanso kuchedwa kukonza, ndikuwongolera ma siginecha amagetsi a tchipisi ta semiconductor," watero mkulu wa Samsung Electronics.Mu 2027, Samsung ikukonzekera kuyambitsa ukadaulo wophatikizira wamitundu yonse womwe umaphatikiza zinthu zowoneka bwino zomwe zimachulukitsa kwambiri kuthamanga kwa ma semiconductors kukhala phukusi limodzi lolumikizana la AI accelerators.
Mogwirizana ndi kufunikira kwa tchipisi tochepa, tchipisi tapamwamba kwambiri, HBM ikuyembekezeka kupanga 30% ya msika wa DRAM mu 2025 kuchokera 21% mu 2024, malinga ndi TrendForce, kampani yofufuza yaku Taiwan.
Kafukufuku wa MGI aneneratu za msika wotsogola, kuphatikiza ma 3D ma CD, kukula mpaka $80 biliyoni pofika 2032, poyerekeza ndi $34.5 biliyoni mu 2023.
Nthawi yotumiza: Jun-10-2024