Kupaka kwa semiconductor kwasintha kuchokera ku mapangidwe achikhalidwe a 1D PCB kupita kumtundu wa 3D wosakanizidwa womangira pamlingo wawafer. Kupita patsogolo kumeneku kumapangitsa kuti pakhale malo olumikizirana mumtundu wa micron wa digito imodzi, wokhala ndi ma bandwidth mpaka 1000 GB/s, ndikusunga mphamvu zambiri. Pakatikati pa matekinoloje apamwamba a semiconductor packaging ndi 2.5D ma CD (pomwe zigawo zimayikidwa mbali ndi mbali pagawo lapakati) ndi ma CD a 3D (omwe amaphatikiza tchipisi tating'onoting'ono). Ukadaulo uwu ndi wofunikira mtsogolo mwa machitidwe a HPC.
Ukadaulo wamapaketi a 2.5D umaphatikizapo zida zingapo zapakati, chilichonse chili ndi zabwino zake komanso zovuta zake. Zigawo zapakati za silicon (Si), kuphatikiza zowotcha za silicon zokhazikika komanso milatho ya silicon yokhazikika, amadziwika kuti amapereka luso la waya labwino kwambiri, kuwapanga kukhala abwino pakompyuta yogwira ntchito kwambiri. Komabe, ndi okwera mtengo malinga ndi zida ndi kupanga komanso zoperewera pamapaketi. Kuti muchepetse zovuta izi, kugwiritsa ntchito milatho ya silicon komweko kukuchulukirachulukira, kugwiritsa ntchito mwanzeru silicon komwe magwiridwe antchito ndi ofunika kwambiri pothana ndi zovuta zadera.
Zigawo zapakati za organic, pogwiritsa ntchito mapulasitiki opangidwa ndi fan-out, ndi njira yotsika mtengo kuposa silicon. Amakhala ndi ma dielectric otsika, omwe amachepetsa kuchedwa kwa RC mu phukusi. Ngakhale zabwino izi, zigawo zapakati za organic zimalimbana kuti zikwaniritse gawo lofananira lochepetsera zolumikizira monga zoyika pa silicon, ndikuchepetsa kutengera kwawo pamakompyuta apamwamba kwambiri.
Magalasi apakatikati achita chidwi kwambiri, makamaka kutsatira kukhazikitsidwa kwaposachedwa kwa Intel kwamagalimoto oyeserera pamagalasi. Galasi imapereka zabwino zingapo, monga choyezera chosinthika cha kukula kwa matenthedwe (CTE), kukhazikika kwapamwamba, malo osalala ndi athyathyathya, komanso kuthekera kothandizira kupanga magulu, ndikupangitsa kuti ikhale yodalirika pamagawo apakatikati okhala ndi ma waya ofananira ndi silicon. Komabe, pambali pa zovuta zaukadaulo, cholepheretsa chachikulu cha zigawo za magalasi ndi kusakhwima kwachilengedwe komanso kusowa kwaposachedwa kwamphamvu zopanga zazikulu. Pamene chilengedwe chikukhwima komanso kupanga bwino, matekinoloje opangira magalasi mumapangidwe a semiconductor amatha kuwona kukula ndi kutengera.
Pankhani yaukadaulo wamapaketi a 3D, Cu-Cu bump-less hybrid bonding ikukhala ukadaulo wotsogola. Njira yapamwambayi imakwaniritsa kulumikizana kosatha mwa kuphatikiza zida za dielectric (monga SiO2) ndi zitsulo zophatikizidwa (Cu). Kugwirizana kwa Cu-Cu hybrid kutha kukwaniritsa mipata yochepera 10 ma micron, nthawi zambiri mumtundu wa ma micron a manambala amodzi, kuyimira kusintha kwakukulu paukadaulo wakale wa micro-bump, womwe umakhala ndi mipata yofikira pafupifupi ma 40-50. Ubwino wamalumikizidwe osakanizidwa akuphatikiza kuchuluka kwa I/O, bandwidth yowonjezereka, kutukuka kosunthika kwa 3D, kuyendetsa bwino mphamvu kwamphamvu, komanso kuchepa kwa parasitic komanso kukana kwamafuta chifukwa chosowa kudzaza pansi. Komabe, teknolojiyi ndi yovuta kupanga ndipo imakhala ndi ndalama zambiri.
2.5D ndi 3D ma CD matekinoloje amaphatikiza njira zosiyanasiyana zopangira. Pakuyika kwa 2.5D, kutengera kusankha kwa zida zapakati, zitha kugawidwa m'magulu a silicon-based, organic-based, and glass-based intermediary layers, monga momwe tawonetsera pa chithunzi pamwambapa. Pakuyika kwa 3D, kupanga ukadaulo wa micro-bump ndicholinga chochepetsera miyeso, koma masiku ano, potengera ukadaulo wolumikizana wosakanizidwa (njira yolumikizirana ya Cu-Cu), miyeso yolumikizana ndi manambala amodzi imatha kukwaniritsidwa, zomwe zikuwonetsa kupita patsogolo kwakukulu m'munda. .
**Ndemanga Zofunikira Zatekinoloje Zomwe Muyenera Kuwonera:**
1. **Madera Aakulu Apakati:** IDTechEx idaneneratu kale kuti chifukwa cha zovuta za zigawo za silicon zodutsa malire a 3x reticle size, 2.5D silicon bridge solution posachedwapa idzalowa m'malo mwa silicon intermediary zigawo monga chisankho chachikulu choyika tchipisi ta HPC. TSMC ndiwogulitsa kwambiri zigawo za silicon 2.5D za NVIDIA ndi opanga ena otsogola a HPC monga Google ndi Amazon, ndipo kampaniyo posachedwapa yalengeza kupanga kwakukulu kwa CoWoS_L ya m'badwo wake woyamba wokhala ndi 3.5x reticle size. IDTechEx ikuyembekeza kuti izi zipitilira, ndikupita patsogolo komwe kumakambidwa mu lipoti lake lokhudza osewera akulu.
2. **Kupaka Pagulu-Mulingo:** Kupaka pagulu kwakhala kofunikira kwambiri, monga momwe zidawonetsedwera pa 2024 Taiwan International Semiconductor Exhibition. Njira yopakirayi imalola kugwiritsa ntchito zigawo zazikuluzikulu zapakati ndipo imathandizira kuchepetsa ndalama popanga mapaketi ambiri nthawi imodzi. Ngakhale zili ndi kuthekera, zovuta monga kasamalidwe ka warpage ziyenera kuthetsedwa. Kuchulukirachulukira kwake kukuwonetsa kufunikira kwa zigawo zazikulu, zotsika mtengo.
3. **Glass Intermediary Layers:** Galasi ikuwoneka ngati chinthu champhamvu chothandizira kukwaniritsa waya wabwino, wofanana ndi silicon, wokhala ndi maubwino ena monga CTE yosinthika komanso kudalirika kwambiri. Magalasi apakatikati a magalasi amagwirizananso ndi kuyika kwapanel-level, kumapereka mwayi wopangira mawaya apamwamba kwambiri pamtengo wokhoza kuwongolera, zomwe zimapangitsa kukhala njira yabwino yothetsera matekinoloje amtsogolo.
4. **HBM Hybrid Bonding:** 3D copper-copper (Cu-Cu) hybrid bonding ndi ukadaulo wofunikira kwambiri pakukwaniritsa kulumikizana kopitilira muyeso pakati pa tchipisi. Tekinolojeyi yakhala ikugwiritsidwa ntchito pazinthu zosiyanasiyana zamaseva apamwamba kwambiri, kuphatikiza AMD EPYC ya SRAM ndi ma CPU odzaza, komanso mndandanda wa MI300 woyika midadada ya CPU/GPU pa I/O ikafa. Kumangirira kophatikizana kukuyembekezeka kutenga gawo lofunikira pakupita patsogolo kwa HBM, makamaka pamapaketi a DRAM opitilira 16-Hi kapena 20-Hi.
5. **Co-Packaged Optical Devices (CPO):** Ndi kufunikira kwa kuchuluka kwa kutulutsa kwa data komanso kugwiritsa ntchito mphamvu, ukadaulo wa optical interconnect wapeza chidwi kwambiri. Co-packaged Optical devices (CPO) akukhala yankho lofunikira pakukweza bandwidth ya I/O ndikuchepetsa kugwiritsa ntchito mphamvu. Poyerekeza ndi kufalikira kwamagetsi kwachikhalidwe, kulumikizana kwa kuwala kumapereka maubwino angapo, kuphatikiza kutsika kwa siginecha pamtunda wautali, kutsika kwamphamvu kwa crosstalk, komanso kuchuluka kwa bandwidth. Ubwinowu umapangitsa CPO kukhala chisankho choyenera pamakina a HPC ochulukirachulukira, osagwiritsa ntchito mphamvu.
**Makina Ofunika Kuwonera:**
Msika woyambirira womwe ukuyendetsa chitukuko cha ukadaulo wapackage wa 2.5D ndi 3D mosakayikira ndi gawo lapamwamba la computing (HPC). Njira zonyamula zapamwambazi ndizofunikira kwambiri kuthana ndi malire a Lamulo la Moore, ndikupangitsa ma transistors ambiri, kukumbukira, ndi kulumikizana mkati mwa phukusi limodzi. Kuwola kwa tchipisi kumathandiziranso kugwiritsa ntchito moyenera ma node pakati pa midadada yogwira ntchito zosiyanasiyana, monga kulekanitsa midadada ya I/O ndi midadada yopangira, kupititsa patsogolo luso.
Kuphatikiza pa makompyuta ochita bwino kwambiri (HPC), misika ina ikuyembekezekanso kukula mwa kutengera matekinoloje apamwamba onyamula. M'magawo a 5G ndi 6G, zotsogola monga ma antennas oyika ndi ma chip-m'mphepete mwazitsulo zidzasintha tsogolo la zomangamanga zopanda zingwe (RAN). Magalimoto odziyimira pawokha adzapindulanso, chifukwa matekinolojewa amathandizira kuphatikizika kwa ma sensor suites ndi ma computing unit kuti azitha kuwerengera zambiri ndikuwonetsetsa kuti chitetezo, kudalirika, compactness, mphamvu ndi kasamalidwe ka kutentha, komanso kutsika mtengo.
Zipangizo zamagetsi za ogula (kuphatikiza mafoni a m'manja, ma smartwatches, zida za AR/VR, ma PC, ndi malo ogwirira ntchito) akuyang'ana kwambiri pakukonza zambiri m'malo ang'onoang'ono, ngakhale kutsindika kwambiri pamtengo. Kupaka kwapamwamba kwa semiconductor kudzakhala ndi gawo lalikulu pazimenezi, ngakhale kuti njira zolembera zikhoza kusiyana ndi zomwe zimagwiritsidwa ntchito mu HPC.
Nthawi yotumiza: Oct-25-2024