Mapaketi a semiconductor asintha kuchoka pa mapangidwe achikhalidwe a 1D PCB kupita ku ma bonding apamwamba a 3D hybrid pamlingo wa wafer. Kupita patsogolo kumeneku kumalola malo olumikizirana mumtundu umodzi wa micron, ndi ma bandwidth ofika 1000 GB/s, pomwe kumasunga mphamvu zambiri. Pakati pa ukadaulo wapamwamba wa ma packing a semiconductor pali ma packing a 2.5D (komwe zigawo zimayikidwa pambali pa gawo lapakati) ndi ma packing a 3D (omwe amaphatikizapo kuyika ma chips ogwira ntchito molunjika). Maukadaulo awa ndi ofunikira kwambiri mtsogolo mwa machitidwe a HPC.
Ukadaulo wa ma CD a 2.5D umaphatikizapo zipangizo zosiyanasiyana zolumikizirana, chilichonse chili ndi ubwino ndi kuipa kwake. Zigawo zolumikizirana za Silicon (Si), kuphatikizapo ma wafer a silicon osagwira ntchito mokwanira ndi milatho ya silicon yolumikizirana, zimadziwika kuti zimapereka mphamvu zabwino kwambiri zolumikizirana, zomwe zimapangitsa kuti zikhale zabwino kwambiri pakompyuta yogwira ntchito bwino. Komabe, zimakhala zodula pankhani ya zipangizo ndi kupanga ndipo zimakhala ndi zofooka m'malo olumikizirana. Pofuna kuchepetsa mavutowa, kugwiritsa ntchito milatho ya silicon yolumikizirana kukuchulukirachulukira, pogwiritsa ntchito silicon komwe magwiridwe antchito abwino ndi ofunikira kwambiri pothana ndi zopinga za m'deralo.
Ma layers apakati a organic, pogwiritsa ntchito mapulasitiki opangidwa ndi fan-out, ndi njira ina yotsika mtengo kwambiri m'malo mwa silicon. Ali ndi dielectric constant yotsika, yomwe imachepetsa kuchedwa kwa RC mu phukusi. Ngakhale zabwino izi, ma layers apakati a organic amavutika kuti akwaniritse mulingo womwewo wa kuchepetsa mawonekedwe olumikizirana monga ma packaging a silicon, zomwe zimalepheretsa kugwiritsidwa ntchito kwawo mu mapulogalamu apamwamba a makompyuta.
Zigawo zolumikizira magalasi zakopa chidwi chachikulu, makamaka pambuyo poti Intel yatulutsa posachedwapa ma phukusi a magalimoto oyesera pogwiritsa ntchito magalasi. Galasi imapereka zabwino zingapo, monga adjustable coefficient of thermal expansion (CTE), high dimension stability, malo osalala komanso athyathyathya, komanso kuthekera kothandizira kupanga mapanelo, zomwe zimapangitsa kuti ikhale yoyenera kwa zigawo zolumikizira zomwe zili ndi mphamvu zolumikizira zofanana ndi silicon. Komabe, kupatula zovuta zaukadaulo, vuto lalikulu la zigawo zolumikizira magalasi ndi chilengedwe chosakhwima komanso kusowa kwa mphamvu yayikulu yopangira. Pamene chilengedwe chikukula ndi kuthekera kopanga zinthu kukukula, ukadaulo wogwiritsa ntchito magalasi mu ma phukusi a semiconductor ukhoza kuwona kukula ndi kuyambitsidwa kwina.
Ponena za ukadaulo wa ma CD a 3D, Cu-Cu bump-less hybrid bonding ikukhala ukadaulo wotsogola kwambiri. Njira yapamwambayi imakwaniritsa kulumikizana kosatha mwa kuphatikiza zida zamagetsi (monga SiO2) ndi zitsulo zoyikidwa (Cu). Cu-Cu hybrid bonding imatha kufikira mipata yochepera ma microns 10, nthawi zambiri mu micron ya manambala amodzi, zomwe zikuyimira kusintha kwakukulu poyerekeza ndi ukadaulo wachikhalidwe wa micro-bump, womwe uli ndi mipata yochepera ma microns 40-50. Ubwino wa hybrid bonding ndi monga kuwonjezeka kwa I/O, bandwidth yowonjezereka, kukweza 3D vertical stacking, kugwiritsa ntchito bwino mphamvu, komanso kuchepa kwa zotsatira za parasitic komanso kukana kutentha chifukwa chosowa kudzaza pansi. Komabe, ukadaulo uwu ndi wovuta kupanga ndipo uli ndi ndalama zambiri.
Ukadaulo wa ma CD a 2.5D ndi 3D umaphatikizapo njira zosiyanasiyana zopakira. Mu ma CD a 2.5D, kutengera kusankha kwa zipangizo zopakira, zitha kugawidwa m'magulu a silicon-based, organic-based, ndi glass-based intermediary layers, monga momwe zasonyezedwera pachithunzi pamwambapa. Mu ma CD a 3D, chitukuko cha ukadaulo wa micro-bump cholinga chake ndi kuchepetsa miyeso ya malo, koma masiku ano, pogwiritsa ntchito ukadaulo wophatikizana (njira yolumikizira mwachindunji ya Cu-Cu), miyeso ya malo ya manambala amodzi ikhoza kukwaniritsidwa, zomwe zikusonyeza kupita patsogolo kwakukulu m'munda.
**Zinthu Zofunika Kwambiri pa Ukadaulo:**
1. **Malo Akuluakulu Okhala ndi Zigawo:** IDTechEx idaneneratu kale kuti chifukwa cha kuvutika kwa zigawo zapakati pa silicon kupitirira malire a kukula kwa reticle 3x, mayankho a 2.5D silicon bridge posachedwa adzalowa m'malo mwa zigawo zapakati pa silicon ngati chisankho chachikulu chopangira ma chips a HPC. TSMC ndi kampani yayikulu yopereka zigawo zapakati pa silicon 2.5D za NVIDIA ndi opanga ena otsogola a HPC monga Google ndi Amazon, ndipo kampaniyo posachedwapa yalengeza kupanga kwakukulu kwa CoWoS_L yake ya m'badwo woyamba yokhala ndi kukula kwa reticle 3.5x. IDTechEx ikuyembekeza kuti izi zipitirire, ndi kupita patsogolo kwina komwe kwafotokozedwa mu lipoti lake lokhudza osewera akuluakulu.
2. **Kupaka Pachimake:** Kupaka pachimake kwakhala chinthu chofunikira kwambiri, monga momwe zasonyezedwera pa Chiwonetsero cha 2024 cha Taiwan International Semiconductor. Njira yopaka iyi imalola kugwiritsa ntchito zigawo zazikulu zapakati ndipo imathandiza kuchepetsa ndalama popanga mapaketi ambiri nthawi imodzi. Ngakhale kuti ili ndi kuthekera, mavuto monga kasamalidwe ka warpage akufunikabe kuthetsedwa. Kutchuka kwake kowonjezereka kukuwonetsa kufunikira kwakukulu kwa zigawo zazikulu komanso zotsika mtengo zapakati.
3. **Zigawo Zolumikizira Magalasi:** Galasi likuwoneka ngati chinthu champhamvu chothandizira kupeza mawaya abwino, ofanana ndi silicon, ndi zabwino zina monga CTE yosinthika komanso kudalirika kwambiri. Zigawo zolumikizira magalasi zimagwirizananso ndi ma phukusi apamwamba, zomwe zimapangitsa kuti mawaya azikhala olimba kwambiri pamitengo yotsika mtengo, zomwe zimapangitsa kuti likhale yankho labwino kwambiri paukadaulo wolumikizira mawaya mtsogolo.
4. **HBM Hybrid Bonding:** 3D copper-copper (Cu-Cu) hybrid bonding ndi ukadaulo wofunikira kwambiri wopezera kulumikizana kwabwino kwambiri pakati pa ma chips. Ukadaulo uwu wagwiritsidwa ntchito pazinthu zosiyanasiyana zapamwamba za seva, kuphatikiza AMD EPYC ya stacked SRAM ndi CPUs, komanso mndandanda wa MI300 woyika ma block a CPU/GPU pa I/O dies. Hybrid bonding ikuyembekezeka kukhala ndi gawo lofunikira pakukweza kwa HBM mtsogolo, makamaka ma DRAM stacks opitilira 16-Hi kapena 20-Hi layers.
5. **Zida Zolumikizirana Zogwirizana (CPO):** Chifukwa cha kufunikira kwakukulu kwa deta yogwiritsidwa ntchito komanso kugwiritsa ntchito bwino mphamvu, ukadaulo wolumikizirana wa optical watchuka kwambiri. Zipangizo zolumikizirana zolumikizana (CPO) zikukhala njira yofunika kwambiri yowonjezerera bandwidth ya I/O ndikuchepetsa kugwiritsa ntchito mphamvu. Poyerekeza ndi kutumiza kwamagetsi kwachikhalidwe, kulumikizana kwa optical kumapereka zabwino zingapo, kuphatikiza kuchepa kwa chizindikiro patali, kuchepa kwa chidwi cha crosstalk, komanso kuwonjezeka kwakukulu kwa bandwidth. Zabwino izi zimapangitsa CPO kukhala chisankho chabwino kwambiri cha machitidwe a HPC omwe amagwiritsa ntchito deta yambiri komanso osagwiritsa ntchito mphamvu zambiri.
**Misika Yofunika Kuiyang'anira:**
Msika waukulu womwe ukuyendetsa chitukuko cha ukadaulo wa ma CD a 2.5D ndi 3D mosakayikira ndi gawo la makompyuta apamwamba (HPC). Njira zapamwambazi zomangira ndizofunikira kwambiri pothana ndi zofooka za Moore's Law, zomwe zimapangitsa kuti ma transistors ambiri, kukumbukira, ndi kulumikizana mkati mwa phukusi limodzi. Kuwonongeka kwa ma chips kumathandizanso kugwiritsa ntchito bwino ma process nodes pakati pa ma block osiyanasiyana ogwira ntchito, monga kulekanitsa ma block a I/O ndi ma block ogwirira ntchito, zomwe zimapangitsa kuti magwiridwe antchito azigwira ntchito bwino.
Kuwonjezera pa makompyuta amphamvu kwambiri (HPC), misika ina ikuyembekezekanso kukula kudzera mukugwiritsa ntchito ukadaulo wapamwamba wopaka. M'magawo a 5G ndi 6G, zatsopano monga ma antenna opaka ndi njira zamakono zopezera ma chip zidzasintha tsogolo la zomangamanga za netiweki yopanda zingwe (RAN). Magalimoto odziyimira pawokha adzapindulanso, chifukwa ukadaulo uwu umathandizira kuphatikiza ma sensor suites ndi mayunitsi okampani kuti agwiritse ntchito deta yambiri pomwe akuwonetsetsa kuti pali chitetezo, kudalirika, kuphweka, mphamvu ndi kasamalidwe ka kutentha, komanso kugwiritsa ntchito ndalama moyenera.
Zipangizo zamagetsi zomwe anthu amagwiritsa ntchito (kuphatikizapo mafoni a m'manja, ma watchwatch, zida za AR/VR, ma PC, ndi malo ogwirira ntchito) zikuganizira kwambiri kukonza deta yambiri m'malo ang'onoang'ono, ngakhale kuti mtengo wake ukukwera kwambiri. Ma package apamwamba a semiconductor adzakhala ndi gawo lofunika kwambiri pa izi, ngakhale njira zopakira zitha kusiyana ndi zomwe zimagwiritsidwa ntchito mu HPC.
Nthawi yotumizira: Okutobala-07-2024