Foxconn ikhoza kugula fakitale yopaka mapaketi ku Singapore

Pa Meyi 26, zinanenedwa kuti Foxconn ikuganizira zogula kampani yopangira ndi kuyesa ya United Test and Assembly Centre (UTAC) yochokera ku Singapore, yomwe ili ndi mtengo wokwana madola 3 biliyoni aku US. Malinga ndi akatswiri odziwa bwino ntchito zamakampani, kampani yayikulu ya UTAC, Beijing Zhilu Capital, yalemba ntchito banki yayikulu ya ndalama ya Jefferies kuti itsogolere kugulitsaku ndipo ikuyembekezeka kulandira ma bid oyamba kumapeto kwa mwezi uno. Pakadali pano, palibe chipani chomwe chanenapo kanthu pankhaniyi.

Ndikofunikira kudziwa kuti kapangidwe ka bizinesi ya UTAC ku China yayikulu kamapangitsa kuti ikhale chandamale chabwino kwa omwe si a ku America omwe ali ndi ndalama zambiri. Pokhala kampani yayikulu kwambiri padziko lonse lapansi yopanga zinthu zamagetsi komanso yogulitsa kwambiri ku Apple, Foxconn yawonjezera ndalama zake mumakampani opanga zinthu zamagetsi m'zaka zaposachedwa. UTAC yomwe idakhazikitsidwa mu 1997, ndi kampani yokonza ndi kuyesa zinthu zamagetsi yokhala ndi bizinesi m'magawo osiyanasiyana kuphatikiza zamagetsi, zida zamakompyuta, chitetezo ndi ntchito zachipatala. Kampaniyo ili ndi malo opangira zinthu ku Singapore, Thailand, China ndi Indonesia, ndipo imatumikira makasitomala kuphatikiza makampani opanga zinthu zopanda nsalu, opanga zida zophatikizika (IDMs) ndi mafakitale opangira zinthu za wafer.

Ngakhale UTAC sinawulule zambiri zachuma, zanenedwa kuti EBITDA yake ya pachaka ndi pafupifupi US$300 miliyoni. Poganizira za kusintha kwa makampani opanga ma semiconductor padziko lonse lapansi, ngati izi zichitika, sizingowonjezera luso la Foxconn lophatikizana molunjika mu unyolo wopereka ma chip, komanso zidzakhudza kwambiri mawonekedwe a unyolo wopereka ma semiconductor padziko lonse lapansi. Izi ndizofunikira kwambiri chifukwa cha mpikisano wokulirapo waukadaulo pakati pa China ndi United States, komanso chidwi chomwe chimaperekedwa ku kuphatikizana kwa makampani ndi kugula kunja kwa United States.