Pa Seputembara 13, 2024, Resonac idalengeza zomanga nyumba yatsopano yopangira zida za SiC (silicon carbide) zama semiconductors amagetsi pa Yamagata Plant ku Higashine City, Yamagata Prefecture. Kumaliza kukuyembekezeka mu gawo lachitatu la 2025.
Malo atsopanowa adzakhala mkati mwa Yamagata Plant ya nthambi yake, Resonac Hard Disk, ndipo adzakhala ndi malo omangira 5,832 square metres. Idzatulutsa zowotcha za SiC (magawo ndi epitaxy). Mu June 2023, Resonac adalandira satifiketi kuchokera ku Unduna wa Zachuma, Zamalonda ndi Zamakampani monga gawo la pulani yotsimikizira zazinthu zofunika zomwe zakhazikitsidwa pansi pa Economic Security Promotion Act, makamaka zida za semiconductor (SiC wafers). Dongosolo lotsimikizira zoperekedwa ndi Unduna wa Zachuma, Zamalonda ndi Zamakampani likufuna ndalama zokwana 30.9 yen mabiliyoni kuti alimbikitse mphamvu yopangira ma SiC wafer m'malo a Oyama City, Tochigi Prefecture; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; ndi Ichihara City, Chiba Prefecture, ndi thandizo la yen biliyoni 10.3.
Dongosololi ndikuyamba kupereka zowotcha za SiC (magawo) ku Oyama City, Hikone City, ndi Higashine City mu Epulo 2027, zomwe zimatha kupanga pachaka zidutswa 117,000 (zofanana ndi mainchesi 6). Kupereka kwa SiC epitaxial wafers ku Ichihara City ndi Higashine City kukuyembekezeka kuyamba mu Meyi 2027, ndikuyembekezeka kwapachaka kwa zidutswa 288,000 (zosasinthika).
Pa Seputembala 12, 2024, kampaniyo idachita mwambo wodabwitsa pamalo omanga omwe adakonzedwa ku Yamagata Plant.
Nthawi yotumiza: Sep-16-2024