Pa Seputembala 13, 2024, Resonac idalengeza za kumanga nyumba yatsopano yopanga ma wafer a SiC (silicon carbide) a ma semiconductor amphamvu ku fakitale yake ya Yamagata ku Higashine City, Yamagata Prefecture. Kumaliza ntchitoyo kukuyembekezeka mu kotala lachitatu la 2025.
Malo atsopanowa adzakhala mkati mwa fakitale ya Yamagata ya kampani yake yothandizana nayo, Resonac Hard Disk, ndipo adzakhala ndi malo omanga okwana masikweya mita 5,832. Adzapanga ma wafer a SiC (substrates ndi epitaxy). Mu June 2023, Resonac adalandira satifiketi kuchokera ku Unduna wa Zachuma, Malonda ndi Makampani ngati gawo la dongosolo lotsimikizira kupezeka kwa zipangizo zofunika zomwe zatchulidwa pansi pa Economic Security Promotion Act, makamaka zipangizo za semiconductor (SiC wafers). Dongosolo lotsimikizira kupezeka kwa zinthu lomwe lavomerezedwa ndi Unduna wa Zachuma, Malonda ndi Makampani limafuna ndalama zokwana yen 30.9 biliyoni kuti lilimbikitse mphamvu zopangira ma wafer a SiC m'malo osungiramo zinthu ku Oyama City, Tochigi Prefecture; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; ndi Ichihara City, Chiba Prefecture, ndi ndalama zothandizira zokwana yen 10.3 biliyoni.
Dongosololi ndikuyamba kupereka ma wafer a SiC (substrates) ku Oyama City, Hikone City, ndi Higashine City mu Epulo 2027, okhala ndi mphamvu yopangira zidutswa 117,000 pachaka (zofanana ndi mainchesi 6). Kupereka ma wafer a SiC epitaxial ku Ichihara City ndi Higashine City kukuyembekezeka kuyamba mu Meyi 2027, ndi mphamvu yoti pachaka ikhale zidutswa 288,000 (zosasinthika).
Pa Seputembala 12, 2024, kampaniyo idachita mwambo wokonzanso malo omangira omwe adakonzedwa ku Yamagata Plant.
Nthawi yotumizira: Sep-16-2024