Samsung Electronics, yomwe kale inali yotsalira kwambiri ku TSMC ya ku Taiwan mumakampani opanga zinthu zopangira zinthu zopangidwa ndi semiconductor, tsopano ikuyang'ana kwambiri pakukweza mpikisano wake waukadaulo ndikufulumizitsa ntchito zake zopezera zinthu zatsopano. Kale, chifukwa cha kuchuluka kochepa kwa zokolola, Samsung idakumana ndi zovuta poyambitsa koyamba njira yake yapamwamba ya 3nm, koma posachedwapa yakhazikitsa ukadaulo wake wa 3nm ndipo ikugwira ntchito yochepetsa kusiyana ndi TSMC mu njira za 2nm. Akatswiri amakampani akulosera kuti pamene fakitale yake yopanga zinthu zopangidwa ndi wafer ku Taylor, Texas, ikuwonjezera mphamvu pang'onopang'ono, bizinesi ya Samsung yopanga zinthu zopangidwa ndi wafer ikuyembekezeka kukhala yopindulitsa kuyambira mu 2027, zomwe zikuwonetsa kuyamba kovomerezeka kwa kufunafuna kwathunthu kwa Samsung TSMC.
Kukula kwa Mphamvu ya 2nm
Kampani yofufuza za msika ya Counterpoint Research inaneneratu pa 20 kuti mphamvu ya Samsung yokonza ma process a 2nm idzawonjezeka ndi 163%, kuchoka pa ma wafer 8,000 pamwezi mu 2024 kufika pa ma wafer 21,000 pamwezi pofika kumapeto kwa chaka chamawa. Kukula kwa mphamvu kumeneku kumadalira phindu lokhazikika la njira ya Samsung ya 2nm. Counterpoint Research inanena kuti: "Pamene Samsung ikupambana makasitomala ambiri m'magawo monga mafoni, ma supercomputing, ndi luntha lochita kupanga, kupita patsogolo kwa njira yake ya 2nm kungakhale poyambira kwambiri. Ngati zokolola zipitirirabe kukula ndi kupanga kwakukulu ku fakitale ya Taylor kupita patsogolo bwino, Samsung ikuyembekezeka kuchepetsa kwambiri kusiyana kwa mpikisano ndi TSMC m'munda wamakono wokonza ma process koyamba m'mibadwomibadwo."
Pakadali pano, phindu la Samsung la 2nm process likuyembekezeka kufika pa 55% mpaka 60%. Kupita patsogolo kumeneku kwakopa makasitomala ambiri akuluakulu kuti agwiritse ntchito njira yake yapamwamba. Mu Julayi chaka chino, Samsung yasayina pangano la $16.5 biliyoni (pafupifupi 24.28 trillion won) ndi Tesla kuti ipange chip yake ya AI6 ya m'badwo wotsatira. Kuphatikiza apo, Samsung yapezanso maoda a Exynos 2600 smartphone application processor (AP) kuchokera ku Samsung System LSI, zithunzi zowunikira kuchokera ku Apple, ndi ma ASICs a cryptocurrency minda kuchokera ku makampani aku China WIFI ndi Canaan Technology. Ma AP a Qualcomm akuyembekezekanso kulandira maoda posachedwa.
Njira zosinthira mitengo zimakopa makasitomala
Malinga ndi deta ya TrendForce, TSMC inali yolamulira msika wa zopangira zitsulo za wafer mu kotala lachiwiri ndi gawo la msika la 70.2%, pomwe Samsung Electronics inali ndi gawo la msika la 7.3%. Kusiyana kumeneku kunachepa kufika pa 30 peresenti mu 2019, koma kuyambira pamenepo kwakulanso.
Komabe, makampani aukadaulo nthawi zambiri amakhulupirira kuti Samsung imatha kupikisana ndi TSMC mu gawo la njira ya 2nm. Samsung idayambitsa ukadaulo wa Gate-All-Around (GAA) mu njira yake ya 3nm, zomwe zimachepetsa kutayikira kwamagetsi ndikukweza kwambiri magwiridwe antchito ndi kugwiritsa ntchito mphamvu poyerekeza ndi mapangidwe achikhalidwe a FinFET. Samsung idagwiritsa ntchito ukadaulo wa GAA kuyambira njira yake ya 3nm kupita mtsogolo, pomwe TSMC sinayambe kuugwiritsa ntchito mpaka njira yake ya 2nm. Munthu wina wodziwa bwino zamakampani adati, "Samsung idagonjetsa zovuta za njira ya 3nm ndipo idapeza chidziwitso chambiri ndi GAA, ndikuyiyika pamalo osiyana kwambiri poyerekeza ndi TSMC, yomwe yangoyamba kumene kugwiritsa ntchito ukadaulo watsopanowu."
Pakadali pano, TSMC ikukumana ndi kuwonjezeka kwa maoda ochokera kwa makasitomala akuluakulu monga Nvidia ndi Apple. Malipoti akusonyeza kuti TSMC yakweza mtengo wa ma wafer ake a 2nm ndi 50% poyerekeza ndi mibadwo yakale. Izi zitha kupindulitsa Samsung, yomwe ikugwiritsa ntchito njira zosinthira mitengo kuti ikope makasitomala. Mwa kuyang'ana kwambiri pakupeza makasitomala osiyanasiyana opanga zinthu ndi kuchuluka kwa zopangira, bizinesi ya Samsung yopanga zinthu yawonetsa zizindikiro zakuchira. Posachedwapa, Samsung idapambana mapangano opanga kuchokera ku makampani atsopano a semiconductor a AI aku US Chabarite (4nm) ndi Anaphae (28nm), komanso kampani yatsopano yaku South Korea DeepX (2nm). Katswiri wina wamkati wamakampani opanga zinthu za semiconductor adati, "Kuyang'ana kwambiri kwa TSMC pa makampani akuluakulu aukadaulo monga Nvidia ndi Apple kumapangitsa kuti zikhale zovuta kuti alandire maoda atsopano pamene akukweza mitengo ya ma wafer. Izi zimapangitsa kuti Samsung ikhale ndi msika wapadera womwe Samsung ingagwiritse ntchito."
Kukwaniritsa Zolinga za Phindu
Makampani opanga ukadaulo akuyembekeza kuti bizinesi ya Samsung yopanga zitsulo, yomwe yakhala ikutaya mabiliyoni ambiri a zopambana kotala lililonse kwa zaka zambiri, ibwerere ku phindu kuyambira mu 2027. Izi makamaka zimachitika chifukwa cha kuwonjezeka kwa mphamvu zomwe zikuyembekezeredwa pafakitale yake ya Austin komanso kupanga kwakukulu kwa chip cha Tesla cha AI6 ku fakitale ya Taylor, kuyambira mu 2027.
Mu lipoti lake la ndalama zomwe zapezeka mu kotala lachitatu, Samsung inati, "Tapeza maoda olembedwa omwe amayang'ana kwambiri njira zamakono, kuphatikizapo mapangano ambiri a makasitomala a njira yathu ya 2nm. Pamene zinthu zatsopano zomwe zimagwiritsa ntchito njira yathu ya 2nm zikuyamba kupanga zinthu zambiri, tikuyembekeza kuti magwiridwe antchito azikula kwambiri kudzera mukupitilizabe kupanga zinthu komanso njira zotsika mtengo."
Nthawi yotumizira: Novembala-10-2025