Makampani opanga ma chip a magalimoto akusintha
Posachedwapa, gulu la mainjiniya a semiconductor linakambirana za ma chips ang'onoang'ono, ma hybrid bonding, ndi zinthu zatsopano ndi Michael Kelly, Wachiwiri kwa Purezidenti wa Amkor's small chip ndi FCBGA integration. Ena omwe adatenga nawo mbali mu zokambiranazi anali William Chen, wofufuza wa ASE, CEO wa Promex Industries Dick Otte, ndi Sander Roosendaal, Mtsogoleri wa R&D wa Synopsys Photonics Solutions. Pansipa pali chidule cha zokambiranazi.
Kwa zaka zambiri, kupanga ma chips a magalimoto sikunatenge malo otsogola mumakampani. Komabe, chifukwa cha kukwera kwa magalimoto amagetsi komanso chitukuko cha makina apamwamba osangalatsa, vutoli lasintha kwambiri. Ndi mavuto ati omwe mwaona?
Kelly: ADAS yapamwamba kwambiri (Advanced Driver Assistance Systems) imafuna kuti ma processor okhala ndi njira ya nanometer 5 kapena yaying'ono apikisane pamsika. Mukangoyamba njira ya nanometer 5, muyenera kuganizira za mtengo wa wafer, zomwe zimapangitsa kuti muganizire mosamala njira zazing'ono zopangira chip, chifukwa zimakhala zovuta kupanga ma chip akulu pa njira ya nanometer 5. Kuphatikiza apo, phindu limakhala lochepa, zomwe zimapangitsa kuti pakhale ndalama zambiri. Pogwira ntchito ndi njira za nanometer 5 kapena zapamwamba kwambiri, makasitomala nthawi zambiri amaganizira zosankha gawo la chip ya nanometer 5 m'malo mogwiritsa ntchito chip yonse, pomwe akuwonjezera ndalama mu gawo lolongedza. Angaganize kuti, "Kodi ingakhale njira yotsika mtengo kwambiri kuti mukwaniritse magwiridwe antchito ofunikira mwanjira iyi, m'malo moyesa kumaliza ntchito zonse mu chip yayikulu?" Chifukwa chake, inde, makampani apamwamba opanga magalimoto akulabadira ukadaulo wa ma chip ang'onoang'ono. Makampani otsogola mumakampani akuyang'anira izi mosamala. Poyerekeza ndi gawo la makompyuta, makampani opanga magalimoto mwina ali kumbuyo kwa zaka 2 mpaka 4 pakugwiritsa ntchito ukadaulo wa ma chip ang'onoang'ono, koma momwe amagwiritsidwira ntchito m'magawo a magalimoto ndi omveka bwino. Makampani opanga magalimoto ali ndi zofunikira kwambiri pa kudalirika, kotero kudalirika kwa ukadaulo wa ma chips ang'onoang'ono kuyenera kutsimikiziridwa. Komabe, kugwiritsa ntchito kwakukulu kwa ukadaulo wa ma chips ang'onoang'ono m'munda wamagalimoto kukubwera.
Chen: Sindinaone zopinga zilizonse zazikulu. Ndikuganiza kuti ndikofunika kuphunzira ndikumvetsetsa mozama zofunikira za satifiketi. Izi zibwerera ku mulingo wa metrology. Kodi timapanga bwanji mapaketi omwe amakwaniritsa miyezo yokhwima kwambiri yamagalimoto? Koma ndizotsimikizika kuti ukadaulo woyenera ukusintha nthawi zonse.
Popeza pali mavuto ambiri okhudzana ndi kutentha ndi zovuta zokhudzana ndi zinthu zomwe zimafa kwambiri, kodi padzakhala ma profiles atsopano oyesera kupsinjika maganizo kapena mitundu yosiyanasiyana ya mayeso? Kodi miyezo ya JEDEC yomwe ilipo pano ingakhudze machitidwe ophatikizana otere?
Chen: Ndikukhulupirira kuti tifunika kupanga njira zowunikira bwino kuti tidziwe bwino komwe kumayambitsa kulephera. Takambirana za kuphatikiza metrology ndi diagnostics, ndipo tili ndi udindo wopeza momwe tingapangire ma phukusi olimba kwambiri, kugwiritsa ntchito zipangizo ndi njira zapamwamba kwambiri, ndikuzitsimikizira.
Kelly: Masiku ano, tikuchita kafukufuku wa zitsanzo ndi makasitomala, omwe aphunzirapo kanthu kuchokera ku mayeso a dongosolo, makamaka mayeso okhudza kutentha m'mayeso a bolodi logwira ntchito, omwe sakufotokozedwa mu mayeso a JEDEC. Kuyesa kwa JEDEC ndi kuyesa kwa isothermal kokha, komwe kumaphatikizapo "kukwera kwa kutentha, kugwa, ndi kusintha kwa kutentha." Komabe, kugawa kutentha m'mapaketi enieni sikuli kofanana ndi zomwe zimachitika m'dziko lenileni. Makasitomala ambiri akufuna kuchita mayeso a dongosolo msanga chifukwa akumvetsa izi, ngakhale kuti si aliyense amene akudziwa. Ukadaulo woyeserera umagwiranso ntchito pano. Ngati munthu ali ndi luso loyerekeza kutentha ndi makina osakanikirana, kusanthula mavuto kumakhala kosavuta chifukwa amadziwa zinthu zomwe ayenera kuyang'ana panthawi yoyesa. Kuyesa kwa dongosolo ndi ukadaulo woyerekeza kumathandizirana. Komabe, izi zikadali pachiyambi.
Kodi pali mavuto ambiri okhudza kutentha m'malo ophunzirira ukadaulo okhwima kuposa kale?
Otte: Inde, koma m'zaka zingapo zapitazi, nkhani zokhudzana ndi coplanarity zakhala zikuonekera kwambiri. Tikuwona zipilala zamkuwa 5,000 mpaka 10,000 pa chip, zomwe zili pakati pa ma microns 50 ndi ma microns 127. Ngati mutayang'ana mosamala deta yoyenera, mupeza kuti kuyika zipilala zamkuwa izi pa substrate ndikuchita ntchito zotenthetsera, kuziziritsa, ndi kuyikanso soldering kumafuna kukwaniritsa gawo limodzi mwa kulondola kwa coplanarity 100,000. Gawo limodzi mwa kulondola kwa 100,000 kuli ngati kupeza tsamba la udzu mkati mwa bwalo la mpira. Tagula zida zina zapamwamba za Keyence kuti tiyese kusalala kwa chip ndi substrate. Zachidziwikire, funso lotsatira ndilakuti, kodi tingalamulire bwanji izi panthawi ya reflow soldering? Ili ndi vuto lofunika kwambiri lomwe liyenera kuthetsedwa.
Chen: Ndikukumbukira zokambirana zokhudza Ponte Vecchio, komwe ankagwiritsa ntchito solder yotsika kutentha poganizira za kusonkhana m'malo mwa chifukwa cha magwiridwe antchito.
Popeza kuti mabwalo onse omwe ali pafupi akadali ndi mavuto a kutentha, kodi ma photonics ayenera kuphatikizidwa bwanji mu izi?
Roosendaal: Kuyerekeza kutentha kuyenera kuchitidwa pazinthu zonse, ndipo kuchotsa ma frequency apamwamba ndikofunikiranso chifukwa zizindikiro zomwe zimalowa ndi ma frequency apamwamba. Chifukwa chake, nkhani monga kufananiza impedance ndi nthaka yoyenera ziyenera kuthetsedwa. Pakhoza kukhala kusintha kwakukulu kwa kutentha, komwe kungakhalepo mkati mwa die yokha kapena pakati pa zomwe timatcha "E" die (electrical die) ndi "P" die (photon die). Ndikufuna kudziwa ngati tifunika kufufuza mozama za mawonekedwe a kutentha kwa zomatira.
Izi zikubweretsa zokambirana zokhudza zipangizo zomangira, kusankha kwawo, ndi kukhazikika pakapita nthawi. N'zoonekeratu kuti ukadaulo wophatikizana wakhala ukugwiritsidwa ntchito m'dziko lenileni, koma sunagwiritsidwe ntchito popanga zinthu zambiri. Kodi ukadaulo uwu uli bwanji pakadali pano?
Kelly: Magulu onse omwe ali mu unyolo wopereka zinthu akuyang'ana kwambiri ukadaulo wa hybrid bonding. Pakadali pano, ukadaulo uwu ukutsogoleredwa makamaka ndi ma foundry, koma makampani a OSAT (Outsourced Semiconductor Assembly and Test) nawonso akuphunzira mozama momwe amagwiritsidwira ntchito pamalonda. Zida zolumikizirana za copper hybrid dielectric zatsimikiziridwa kwa nthawi yayitali. Ngati ukhondo ungawongoleredwe, njirayi imatha kupanga zida zolimba kwambiri. Komabe, ili ndi zofunikira kwambiri paukhondo, ndipo ndalama zogulira zida ndi zapamwamba kwambiri. Tinayesa kugwiritsa ntchito koyambirira mu mzere wa AMD's Ryzen product, komwe SRAM yambiri idagwiritsa ntchito ukadaulo wa copper hybrid bonding. Komabe, sindinawone makasitomala ena ambiri akugwiritsa ntchito ukadaulo uwu. Ngakhale uli pa mapu aukadaulo amakampani ambiri, zikuwoneka kuti zitenga zaka zingapo kuti zida zokhudzana nazo zikwaniritse zofunikira paukhondo wodziyimira pawokha. Ngati ungagwiritsidwe ntchito m'malo opangira fakitale omwe ali ndi ukhondo wochepa pang'ono kuposa nsalu wamba ya wafer, ndipo ngati ndalama zochepa zitha kupezeka, ndiye kuti mwina ukadaulo uwu udzalandira chidwi chochulukirapo.
Chen: Malinga ndi ziwerengero zanga, mapepala osachepera 37 okhudza mgwirizano wa hybrid adzaperekedwa pa msonkhano wa ECTC wa 2024. Iyi ndi njira yomwe imafuna ukatswiri wambiri ndipo imaphatikizapo ntchito zambiri zabwino panthawi yomanga. Chifukwa chake ukadaulo uwu udzagwiritsidwa ntchito kwambiri. Pali kale milandu ina yogwiritsira ntchito, koma mtsogolomu, idzafalikira kwambiri m'magawo osiyanasiyana.
Mukanena za "ntchito zabwino," kodi mukutanthauza kufunika koyika ndalama zambiri?
Chen: Zachidziwikire, zimaphatikizapo nthawi ndi ukatswiri. Kuchita ntchitoyi kumafuna malo oyera kwambiri, zomwe zimafuna ndalama zogulira. Kumafunanso zida zina zofanana, zomwe zimafunanso ndalama. Chifukwa chake izi sizimangokhudza ndalama zogwirira ntchito komanso ndalama zogulira zinthu zina.
Kelly: Pankhani zokhala ndi mtunda wa ma microns 15 kapena kuposerapo, pali chidwi chachikulu chogwiritsa ntchito ukadaulo wa copper pillar wafer-to-wafer. Mwachiyembekezo, ma wafer ndi athyathyathya, ndipo kukula kwa chip si kwakukulu kwambiri, zomwe zimapangitsa kuti pakhale kufalikira kwapamwamba kwa malo ena mwa awa. Ngakhale izi zimabweretsa zovuta zina, ndizotsika mtengo kwambiri kuposa kudzipereka ku ukadaulo wa copper hybrid bonding. Komabe, ngati kufunikira kolondola kuli ma microns 10 kapena kuchepera, zinthu zimasintha. Makampani omwe amagwiritsa ntchito ukadaulo wa chip stacking adzakwaniritsa mtunda wa ma micron amodzi, monga ma microns 4 kapena 5, ndipo palibe njira ina. Chifukwa chake, ukadaulo woyenera udzakula mosalekeza. Komabe, ukadaulo womwe ulipo ukupitilizabe kusintha. Chifukwa chake tsopano tikuyang'ana kwambiri malire omwe zipilala zamkuwa zingapitirire komanso ngati ukadaulowu udzakhalapo nthawi yayitali kuti makasitomala achedwetse ndalama zonse zopangira ndi "zoyenerera" muukadaulo weniweni wa copper hybrid bonding.
Chen: Tidzagwiritsa ntchito ukadaulo wofunikira pokhapokha ngati pali kufunikira.
Kodi pali zinthu zambiri zatsopano zomwe zikuchitika pakali pano mu gawo la epoxy molding compound?
Kelly: Ma compounds opangidwa ndi utomoni asintha kwambiri. CTE yawo (coefficient of thermal expansion) yachepetsedwa kwambiri, zomwe zapangitsa kuti ikhale yabwino kwambiri pakugwiritsa ntchito moyenera poganizira za kupanikizika.
Otte: Tikabwerera ku zomwe tinakambirana kale, kodi ndi ma chips angati a semiconductor omwe amapangidwa ndi 1 kapena 2 micron spacing?
Kelly: Chiwerengero chachikulu.
Chen: Mwina ochepera 1%.
Otte: Choncho ukadaulo womwe tikukambiranawu si wodziwika bwino. Siwuli mu gawo lofufuza, chifukwa makampani otsogola akugwiritsa ntchito ukadaulo uwu, koma ndi wokwera mtengo ndipo uli ndi phindu lochepa.
Kelly: Izi zimagwiritsidwa ntchito makamaka pa makompyuta ogwira ntchito kwambiri. Masiku ano, sizikugwiritsidwa ntchito kokha m'malo osungira deta komanso m'makompyuta apamwamba komanso ngakhale m'zida zina zonyamulidwa ndi manja. Ngakhale kuti zipangizozi ndi zazing'ono, zimagwirabe ntchito bwino. Komabe, pankhani yokhudza ma processor ndi ma CMOS, kuchuluka kwake kumakhala kochepa. Kwa opanga ma chip wamba, palibe chifukwa chogwiritsa ntchito ukadaulo uwu.
Otte: Ndicho chifukwa chake n'zosadabwitsa kuona ukadaulo uwu ukulowa mumakampani opanga magalimoto. Magalimoto safunikira ma chips kuti akhale ang'onoang'ono kwambiri. Amatha kukhalabe ndi ma nanometer 20 kapena 40, chifukwa mtengo wa transistor iliyonse mu ma semiconductors ndi wotsika kwambiri pa njirayi.
Kelly: Komabe, zofunikira pa makompyuta a ADAS kapena kuyendetsa galimoto yodziyimira payokha ndizofanana ndi za ma AI PC kapena zida zina zofanana. Chifukwa chake, makampani opanga magalimoto amafunika kuyika ndalama muukadaulo wamakono uwu.
Ngati nthawi yogulira zinthu ndi zaka zisanu, kodi kugwiritsa ntchito ukadaulo watsopano kungawonjezere mwayi kwa zaka zina zisanu?
Kelly: Mfundo imeneyi ndi yomveka bwino. Makampani opanga magalimoto ali ndi mbali ina. Taganizirani zowongolera zosavuta za servo kapena zida zosavuta za analog zomwe zakhalapo kwa zaka 20 ndipo ndizotsika mtengo kwambiri. Amagwiritsa ntchito ma chips ang'onoang'ono. Anthu omwe ali mumakampani opanga magalimoto amafuna kupitiliza kugwiritsa ntchito zinthuzi. Amangofuna kuyika ndalama muzipangizo zamakono kwambiri zokhala ndi ma chips ang'onoang'ono a digito ndipo mwina aziphatikiza ndi ma chips a analog otsika mtengo, flash memory, ndi ma chips a RF. Kwa iwo, chitsanzo cha ma chips ang'onoang'ono chimakhala ndi tanthauzo lalikulu chifukwa amatha kusunga zida zambiri zotsika mtengo, zokhazikika, komanso zakale. Sakufuna kusintha magawo awa kapena kufunikira kutero. Kenako, amangofunika kuwonjezera chips chapamwamba cha 5-nanometer kapena 3-nanometer chaching'ono kuti akwaniritse ntchito za gawo la ADAS. Ndipotu, akugwiritsa ntchito mitundu yosiyanasiyana ya ma chips ang'onoang'ono mu chinthu chimodzi. Mosiyana ndi ma PC ndi ma kompyuta, makampani opanga magalimoto ali ndi mitundu yosiyanasiyana ya ntchito.
Chen: Komanso, ma chips awa safunika kuyikidwa pafupi ndi injini, kotero malo okhala ndi zinthu zachilengedwe ndi abwinoko.
Kelly: Kutentha kwa chilengedwe m'magalimoto kumakhala kokwera kwambiri. Chifukwa chake, ngakhale mphamvu ya chip siili yokwera kwambiri, makampani opanga magalimoto ayenera kuyika ndalama zina mu njira zabwino zoyendetsera kutentha ndipo angaganizirenso kugwiritsa ntchito indium TIM (zinthu zolumikizira kutentha) chifukwa nyengo ndi yovuta kwambiri.
Nthawi yotumizira: Epulo-28-2025